DocumentCode
1912310
Title
Experimental investigation of water cooled server microprocessors and memory devices in an energy efficient chiller-less data center
Author
Parida, Pritish R. ; David, Milnes ; Iyengar, Madhusudan ; Schultz, Mark ; Gaynes, Michael ; Kamath, Vinod ; Kochuparambil, Bejoy ; Chainer, Timothy
Author_Institution
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
2012
fDate
18-22 March 2012
Firstpage
224
Lastpage
231
Abstract
Understanding and improving the thermal management and energy efficiency of data center cooling systems is of growing importance from a cost and sustainability perspective. Toward this goal, warm liquid cooled servers were developed to enable highly energy efficient chiller-less data centers that utilize only “free” ambient environment cooling. This approach greatly reduces cooling energy use, and could reduce data center refrigerant and make up water usage. In one exemplary experiment, a rack having such liquid cooled servers was tested on a hot summer day (~32°C) with CPU exercisers and memory exercisers running on every server to provide steady heat dissipation from the processors and from the DIMMs, respectively. Compared to a typical air cooled rack, significantly lower DIMM temperatures and CPU thermal values were observed.
Keywords
computer centres; cooling; energy conservation; network servers; CPU exercisers; CPU thermal values; DIMM; cooling energy use; data center cooling systems; data center refrigerant; energy efficiency; energy efficient chiller-less data center; free ambient environment cooling; memory devices; memory exercisers; steady heat dissipation; thermal management; warm liquid cooled servers; water cooled server microprocessors; water usage; Coolants; Heating; Liquid cooling; Program processors; Servers; Temperature sensors; Chiller-less data centers; Data-center; energy efficient; liquid cooled servers;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
978-1-4673-1110-6
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2012.6188852
Filename
6188852
Link To Document