Use of ducting to improve inlet air conditions for side-to-side airflow switches in data centers

Author

Fleming, Jim ; Narasimhan, Susheela

Author_Institution

Panduit, Burr Ridge, IL, USA

fYear

2012

fDate

18-22 March 2012

Firstpage

293

Lastpage

301

Abstract

Switches deployed in data centers often utilize side-to-side airflow cooling. This airflow pattern can cause heated exhaust air to flow to the inlet of adjacent equipment in open rack installations or re-circulate to the switch inlet in cabinet applications. Through the use of CFD and testing, ducting solutions have been developed that improve inlet air conditions for both open rack and cabinet applications. Additionally, the ducting solutions make the side-to-side airflow switches compatible with hot aisle/cold aisle layouts as well as air containment solutions.

Keywords

air conditioning; computational fluid dynamics; computer centres; cooling; installation; CFD; adjacent equipment; air containment solutions; data centers; ducting solutions; exhaust air; inlet air conditions; open rack installations; side-to-side airflow cooling; side-to-side airflow switches; Atmospheric modeling; Computational fluid dynamics; Ducts; Fans; Heating; Particle separators; Testing; Data center; Ducts; Side-to-side airflow; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE

Conference_Location

San Jose, CA

ISSN

1065-2221

Print_ISBN

978-1-4673-1110-6

Electronic_ISBN

1065-2221

Type

conf

DOI

10.1109/STHERM.2012.6188863

Filename

6188863