DocumentCode :
1912580
Title :
Enabling power density and thermal-aware floorplanning
Author :
Ardestani, Ehsan K. ; Ziabari, Amirkoushyar ; Shakouri, Ali ; Renau, Jose
Author_Institution :
Sch. of Eng., Univ. of California Santa Cruz, Santa Cruz, CA, USA
fYear :
2012
fDate :
18-22 March 2012
Firstpage :
302
Lastpage :
307
Abstract :
With temperature being one of the main limiting factors in design of high performance processors, early evaluation of thermal effects in design stages is becoming a necessity. Floorplanning is an imperative step in the design process where thermal effects can be taken into account. This work studies a thermal-aware floorplanning scheme, with the goal of increasing both reliability and performance measures of the design. We show that a majority of thermal emergencies can be averted by a) leveraging the lateral heat transfer effects (as has been shown previously), and b) by reducing the power density of thermally critical blocks. The former becomes possible through moving, and modifying the aspect-ratio of the blocks in the floorplanning process. The latter, one of the key contributions of this work, is carried out through resizing of functional blocks in a controlled way. We also propose a selective power map generation method for the floorplanning process. In this method the time windows in which thermal emergencies occur guide the power map generation. As a result, we observed an 8.8% performance improvement, and a 40% reliability increase with the area overhead of just 3%.
Keywords :
circuit layout; heat transfer; integrated circuit reliability; microprocessor chips; thermal management (packaging); heat transfer; high performance processors; power density; power map generation; reliability; thermal effects; thermal-aware floorplanning; Benchmark testing; Educational institutions; Measurement; Reliability; Floorplanning; Power Blurring; architectural level thermal simulator; thermal simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE
Conference_Location :
San Jose, CA
ISSN :
1065-2221
Print_ISBN :
978-1-4673-1110-6
Electronic_ISBN :
1065-2221
Type :
conf
DOI :
10.1109/STHERM.2012.6188864
Filename :
6188864
Link To Document :
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