Title :
Microelectronic Packaging - Future Trends and Application Challenges
Author :
Reichl, H. ; Wolf, J. ; Lang, K.-D.
Author_Institution :
Fraunhofer IZM - Berlin, Germany
Conference_Titel :
Solid-State Device Research Conference, 1998. Proceeding of the 28th European
Conference_Location :
Bordeaux, France
Print_ISBN :
2-86332-234-6
