• DocumentCode
    1912592
  • Title

    Tackling test trade-offs for BIST RTL data paths: BIST area overhead, test application time and power dissipation

  • Author

    Nicolici, Nicolu ; Al-Hashimi, B.M.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    72
  • Lastpage
    81
  • Abstract
    Power dissipation during test application is an emerging problem due to yield and reliability concerns. This paper focuses on BIST for RTL data paths and discusses testability trade-offs in terms of test application time, BIST area overhead and power dissipation. Using a complex validation flow and experimental data for over 30,000 testable data paths, it is shown how test application time decreases asymptotically when increasing power constraints. Further, it is experimentally demonstrated why power conscious test synthesis and test scheduling algorithms are required due to large variations in useless power dissipation as test application time decreases. Finally, while previous research has outlined that test application time decreases as BIST area overhead increases, this paper shows that in order to reach high quality solutions in terms of test application time and BIST area overhead under given power constraints, a three dimensional design space needs to be explored
  • Keywords
    VLSI; automatic testing; built-in self test; design for testability; digital integrated circuits; integrated circuit design; integrated circuit testing; logic testing; low-power electronics; scheduling; BIST area overhead; BIST embedding methodology; RTL data paths; low power VLSI circuits; power conscious test scheduling algorithms; power conscious test synthesis algorithms; power constraints; power dissipation; test application time; testability tradeoffs; three dimensional design space; Application software; Built-in self-test; CMOS technology; Circuit testing; Electronic equipment testing; Logic testing; Power dissipation; Power system reliability; Very large scale integration; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2001. Proceedings. International
  • Conference_Location
    Baltimore, MD
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-7169-0
  • Type

    conf

  • DOI
    10.1109/TEST.2001.966620
  • Filename
    966620