• DocumentCode
    1912612
  • Title

    Cache leakage power estimation using architectural model for 32 nm and 16 nm technology nodes

  • Author

    Zajac, Piotr ; Janicki, Marcin ; Szermer, Michal ; Maj, Cezary ; Pietrzak, Piotr ; Napieralski, Andrzej

  • Author_Institution
    Dept. of Microelectron. & Comput. Sci., Tech. Univ. of Lodz, Lodz, Poland
  • fYear
    2012
  • fDate
    18-22 March 2012
  • Firstpage
    308
  • Lastpage
    312
  • Abstract
    The constant increase of subthreshold current of nanometer transistors due to technology scaling may hinder the evolution of high-performance chips in the near future. This evokes the need of accurate leakage power modeling for new nanometer technologies. In this paper, we present an improved subthreshold current model, which was integrated it into an architectural-level power simulator. Using this simulator, we estimated the leakage power in a 2 MB cache memory for 32 nm and 16 nm technology nodes. Our results show that the cache leakage power dissipation for 2 MB 2-way cache at 100°C fabricated in the 32 nm technology is around 1 W. For the 16 nm technology, we demonstrate the importance of maintaining high threshold voltage to keep leakage power density at the acceptable level.
  • Keywords
    cache storage; leakage currents; nanoelectronics; architectural model; architectural-level power simulator; cache leakage power dissipation; cache leakage power estimation; cache memory; high-performance chips; leakage power modeling; nanometer transistors; size 16 nm; size 32 nm; subthreshold current; technology scaling; Integrated circuit modeling; MOS devices; Mathematical model; SPICE; Subthreshold current; Transistors; Leakage power; architectural modeling; cache; nanometer technologies; subthreshold current;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4673-1110-6
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2012.6188865
  • Filename
    6188865