DocumentCode :
191288
Title :
Aerosol jet printing for 3-D multilayer passive microwave circuitry
Author :
Fan Cai ; Pavlidis, Spyridon ; Papapolymerou, John ; Yung Hang Chang ; Kan Wang ; Zhang, Chuck ; Ben Wang
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2014
fDate :
6-9 Oct. 2014
Firstpage :
512
Lastpage :
515
Abstract :
Aerosol jet printed 3-D coplanar waveguides up to 50 GHz are demonstrated in this paper for the first time featuring a multilayer aerosol jet deposition process. The aerosol jet printing utilized in this paper is the first aerosol jet process to demonstrate multilayer deposition with bi-materials and is host substrate independent. The paper provides an insight into the fabrication process, the technology assessment and the characterization of the polyimide as well as the nano silver particles. The printed polyimide could achieve a thickness of 60 μm. The three-dimensional printed transmission lines demonstrated losses of 0.5 dB/mm at 50 GHz.
Keywords :
aerosols; coplanar waveguides; microwave circuits; passive networks; silver; 3D multilayer passive microwave circuitry; Ag; aerosol jet printed 3-D coplanar waveguides; aerosol jet printing; aerosol jet process; frequency 50 GHz; multilayer aerosol jet deposition process; multilayer deposition; nano silver particles; polyimide; size 60 mum; three-dimensional printed transmission lines; Aerosols; Ink; Polyimides; Printing; Silver; Substrates; Transmission line measurements; 3-D printing; RF; aerosol jet printing; conducting ink; coplanar waveguide; multilayers; silver nano-particle;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference (EuMC), 2014 44th European
Conference_Location :
Rome
Type :
conf
DOI :
10.1109/EuMC.2014.6986483
Filename :
6986483
Link To Document :
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