Aerosol jet printing for 3-D multilayer passive microwave circuitry

Author

Fan Cai ; Pavlidis, Spyridon ; Papapolymerou, John ; Yung Hang Chang ; Kan Wang ; Zhang, Chuck ; Ben Wang

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2014

fDate

6-9 Oct. 2014

Firstpage

512

Lastpage

515

Abstract

Aerosol jet printed 3-D coplanar waveguides up to 50 GHz are demonstrated in this paper for the first time featuring a multilayer aerosol jet deposition process. The aerosol jet printing utilized in this paper is the first aerosol jet process to demonstrate multilayer deposition with bi-materials and is host substrate independent. The paper provides an insight into the fabrication process, the technology assessment and the characterization of the polyimide as well as the nano silver particles. The printed polyimide could achieve a thickness of 60 μm. The three-dimensional printed transmission lines demonstrated losses of 0.5 dB/mm at 50 GHz.

Keywords

aerosols; coplanar waveguides; microwave circuits; passive networks; silver; 3D multilayer passive microwave circuitry; Ag; aerosol jet printed 3-D coplanar waveguides; aerosol jet printing; aerosol jet process; frequency 50 GHz; multilayer aerosol jet deposition process; multilayer deposition; nano silver particles; polyimide; size 60 mum; three-dimensional printed transmission lines; Aerosols; Ink; Polyimides; Printing; Silver; Substrates; Transmission line measurements; 3-D printing; RF; aerosol jet printing; conducting ink; coplanar waveguide; multilayers; silver nano-particle;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference (EuMC), 2014 44th European

Conference_Location

Rome

Type

conf

DOI

10.1109/EuMC.2014.6986483

Filename

6986483