Title :
The Future of High Density Packaging
Author :
Johnson, Barry C.
Author_Institution :
Motorola Semicond. Products Sector, Tempe, AZ, USA
Abstract :
A general overview is presented of high density packaging methods earmarked for use with future leading edge integrated circuits. Pertinent design, performance and cost factors are compared relative to future circuit requirements.
Keywords :
electronics packaging; high density packaging; leading edge integrated circuits; Clocks; Costs; Electronic packaging thermal management; High speed integrated circuits; Integrated circuit interconnections; Integrated circuit packaging; Lead compounds; Pins; Semiconductor device packaging; Signal processing;
Conference_Titel :
Solid State Device Research Conference, 1993. ESSDERC '93. 23rd European
Conference_Location :
Grenoble
