• DocumentCode
    191342
  • Title

    Reduction of the mutual coupling between aperture coupled microstrip patch antennas using EBG structure

  • Author

    Ning Ma ; Huiling Zhao

  • Author_Institution
    Dept. of Electron. & Inf., Northwestern Polytech. Univ., Xian, China
  • fYear
    2014
  • fDate
    24-26 March 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents a method for reducing surface wave coupling between aperture coupled microstrip antennas by the use of mushroom-like electromagnetic band-gap (EBG) structures. Dispersion diagram of the EBG structures was studied by the FDTD method before the EBG structures were combined with the antennas to reduce the mutual coupling. Convolution perfect matched layer (CPML) and periodic boundary conditions (PBCs) were used in the FDTD method for accurate and efficient computing purpose. Case study shows that 16.4dB reduction of the mutual coupling was achieved at the designed resonant frequency by virtue of only a row of EBG structures, and the average reduction in the working band of the antenna was 7.57 dB. Thus, the method can be considered as a potential solution for mutual coupling reduction in array application.
  • Keywords
    aperture-coupled antennas; convolution; couplings; finite difference time-domain analysis; microstrip antenna arrays; photonic band gap; CPML; EBG structure; FDTD method; PBC; aperture coupled microstrip patch antennas; array application; convolution perfect matched layer; dispersion diagram; mushroom-like electromagnetic band-gap structures; mutual coupling reduction; periodic boundary conditions; resonant frequency; surface wave coupling reduction; Couplings; Metamaterials; Microstrip; Microstrip antennas; Mutual coupling; Periodic structures; Surface waves; Aperture coupled microstrip patch antenna; EBG; FDTD; dispersion diagram; mutual coupling reduction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Symposium (IWS), 2014 IEEE International
  • Conference_Location
    X´ian
  • Type

    conf

  • DOI
    10.1109/IEEE-IWS.2014.6864201
  • Filename
    6864201