DocumentCode
1913518
Title
A process infrastructure for architecture analysis and embedded processor development to support a technology insertion process
Author
Hilger, James E.
Author_Institution
Night Vision & Electron. Sensors Directorate, USA
fYear
1997
fDate
24-26 Jun 1997
Firstpage
142
Lastpage
149
Abstract
Commercial off-the-shelf (COTS) technology is being advocated by many as a way to reduce costs in all aspects of systems from initial development to production and field support. Embedded processors in systems, such as those found in military platforms, are examples where the use of COTS technology offers potentially large cost savings. Another important aspect of system cost is the length of time for development. A structured methodology supported by an integrated design environment has been shown to reduce the development time necessary, thus reducing the system development cost. In this paper, an integrated design environment to support architecture analysis and development of embedded processors is described. This integrated design environment is being evaluated and brought online as part of the US Army CECOM Night Vision & Electronic Sensors Directorate process for embedded processor architecture analysis and development
Keywords
computer architecture; design engineering; integrated circuit design; microprocessor chips; military computing; real-time systems; target tracking; US Army CECOM Night Vision & Electronic Sensors Directorate; architecture analysis; commercial off-the-shelf technology; cost savings; development time; embedded processor development; embedded processors; integrated design environment; process infrastructure; structured methodology; system development cost; technology insertion process; Computer architecture; Costs; Mechanical sensors; Night vision; Open systems; Process design; Production systems; Prototypes; Sensor systems; Software design;
fLanguage
English
Publisher
ieee
Conference_Titel
Rapid System Prototyping, 1997. Shortening the Path from Specification to Prototype. Proceedings., 8th IEEE International Workshop on
Conference_Location
Chapel Hill, NC
ISSN
1074-6005
Print_ISBN
0-8186-8064-4
Type
conf
DOI
10.1109/IWRSP.1997.618890
Filename
618890
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