Title :
Advanced military multilayer thick film hybrid design
Author_Institution :
Vitarel Microelectron., San Diego, CA, USA
Abstract :
The author examines design criteria and material issues connected with the production of high-quality nine-layer hybrids for GE Aerospace and their advanced IR sensors. Attention is given to density issues, via design, tiered bonding with thick film, and thick-film materials. These hybrids were manually routed and checked. Subsequent investigations into recent CAD (computer-aided design) technology showed that substantial savings could have been achieved in design time
Keywords :
hybrid integrated circuits; infrared detectors; infrared imaging; military equipment; thick film circuits; CAD; GE Aerospace; advanced IR sensors; density issues; design criteria; multilayer thick film hybrid design; nine-layer hybrids; thick-film materials; tiered bonding; via design; Application specific integrated circuits; Bonding; Conducting materials; Design automation; Dielectric substrates; Microelectronics; Nonhomogeneous media; Packaging; Thick films; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ECTC.1990.122320
