DocumentCode :
1913615
Title :
Temperature influence on UTBOX 1T-DRAM using GIDL for writing operation
Author :
Sasaki, K.R.A. ; Almeida, L.M. ; Martino, J.A. ; Aoulaiche, M. ; Simoen, E. ; Claeys, C.
Author_Institution :
LSI, Univ. of Sao Paulo, São Paulo, Brazil
fYear :
2012
fDate :
14-17 March 2012
Firstpage :
1
Lastpage :
4
Abstract :
This paper investigates the temperature influence on Ultra Thin Buried Oxide (UTBOX) FDSOI devices used as a 1T-DRAM (single transistor dynamic random access memory cell) using GIDL (Gate Induced Drain Leakage) for writing operation through numerical simulations. At higher temperatures, it is observed that the memory window varies and the retention time is degraded, when using a standard read. To solve this issue, we suggest the ZTC read, which fixes the state-0 current independently of the temperature. Moreover, considering I0 current as a reference current for the memory cell operation results in improved retention time.
Keywords :
DRAM chips; silicon-on-insulator; FDSOI device; GIDL; gate induced drain leakage; memory cell operation; memory window; numerical simulation; retention time; single transistor dynamic random access memory cell; state-0 current; temperature influence; ultra thin buried oxide; writing operation; Current density; Logic gates; Programming; Silicon on insulator technology; Temperature distribution; Temperature sensors; Writing; 1TDRAM; GIDL; UTBOX;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Devices, Circuits and Systems (ICCDCS), 2012 8th International Caribbean Conference on
Conference_Location :
Playa del Carmen
Print_ISBN :
978-1-4577-1116-9
Electronic_ISBN :
978-1-4577-1115-2
Type :
conf
DOI :
10.1109/ICCDCS.2012.6188903
Filename :
6188903
Link To Document :
بازگشت