Title :
BGA MPI socket analysis and validation
Author :
Aldana, Francisco Ramirez ; Zenteno, Antonio ; Mendavil, David Reina ; Regalado, Gabriel
Author_Institution :
Intel Tecnol. de Mexico Guadalajara, Guadalajara, Mexico
Abstract :
The design of a ball grid array metalized particle interconnect (BGA MPI) socket is presented. A novel design using static force system using less force and components instead of a dynamic one is shown. The performance of MPI socket has been characterized mechanically as deformation value and electrically as S parameters for different compression force. The MPI has been validated at laboratory using continuity, resistance and validation test. All of tests successfully passed which probed the socket design.
Keywords :
S-parameters; ball grid arrays; semiconductor device metallisation; semiconductor device models; BGA MPI socket analysis; BGA MPI socket validation; BGA metalized particle interconnect; S-parameter; ball grid array; compression force; deformation value; static force system; Capacitance; Electrical resistance measurement; Fasteners; Force; Insertion loss; Resistance; Sockets; MPI socket; Printed circuit board (PCB); S-parameters; continuity test; finite element analysis; resistance test;
Conference_Titel :
Devices, Circuits and Systems (ICCDCS), 2012 8th International Caribbean Conference on
Conference_Location :
Playa del Carmen
Print_ISBN :
978-1-4577-1116-9
Electronic_ISBN :
978-1-4577-1115-2
DOI :
10.1109/ICCDCS.2012.6188927
