DocumentCode :
1914509
Title :
A Comprehensive Analysis of the Relaxation Phenomena in MOSFET´s after Uniform Fowler-Nordheim Injection
Author :
Papadas, C. ; Revil, N. ; Ghibaudo, G. ; Mortini, P. ; Pananakakis, G.
Author_Institution :
SGS-Thomson Microelectron., Central R&D, Grenoble, France
fYear :
1993
fDate :
13-16 Sept. 1993
Firstpage :
543
Lastpage :
546
Abstract :
The Post-Stress period in n-channel MOSFET´s is examined from the viewpoint of Post-Stress variation of the bulk gate oxide degradation features (oxide charge ΔQoxPs and corresponding centroid xbPs). Besides, we demonstrate that the discharging mechanism is not affected by the stress-induced degradation level, neither by the process-induced Hydrogen (H) concentration throughout the MOS structure. Finally, some criticism is conducted on the methods used currently for analyzing the relaxation phase.
Keywords :
MIS structures; MOSFET; carrier relaxation time; discharges (electric); MOS structure; bulk gate oxide degradation features; discharging; n-channel MOSFET; oxide charge; post-stress period; process-induced hydrogen concentration; relaxation phenomena; stress-induced degradation; uniform Fowler-Nordheim injection; Current density; Current measurement; Degradation; Density measurement; Electrons; Linear predictive coding; Microelectronics; Phase measurement; Stress; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1993. ESSDERC '93. 23rd European
Conference_Location :
Grenoble
Print_ISBN :
2863321358
Type :
conf
Filename :
5435560
Link To Document :
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