• DocumentCode
    1914593
  • Title

    The performance and reliability of a new plated copper technology on ceramic

  • Author

    Fudala, John ; Beke, Mike

  • Author_Institution
    Enthone Inc., New Haven, CT, USA
  • fYear
    1990
  • fDate
    20-23 May 1990
  • Firstpage
    1114
  • Abstract
    A plated copper-on-ceramic technology that can be characterized as a ceramic PC (printed circuit) board is described. Adhesion of the plated copper on 96% alumina, 99.5% alumina, beryllium oxide, and aluminum nitrate was evaluated using a peel test method. The plated copper technology is shown to surpass previous plated copper processes in performance and reliability
  • Keywords
    aluminium compounds; beryllium compounds; ceramics; circuit reliability; copper; printed circuit manufacture; Al2O3; AlN; BeO; Cu-Al2O3; Cu-AlN; Cu-BeO; PCB; adhesion; ceramic PC; copper-on-ceramic technology; peel test method; performance; reliability; Ceramics; Chemical technology; Circuits; Conductors; Copper; Gold; Manufacturing industries; Metallization; Metals industry; Thick films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1990. ., 40th
  • Conference_Location
    Las Vegas, NV
  • Type

    conf

  • DOI
    10.1109/ECTC.1990.122324
  • Filename
    122324
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1914593