DocumentCode :
1914593
Title :
The performance and reliability of a new plated copper technology on ceramic
Author :
Fudala, John ; Beke, Mike
Author_Institution :
Enthone Inc., New Haven, CT, USA
fYear :
1990
fDate :
20-23 May 1990
Firstpage :
1114
Abstract :
A plated copper-on-ceramic technology that can be characterized as a ceramic PC (printed circuit) board is described. Adhesion of the plated copper on 96% alumina, 99.5% alumina, beryllium oxide, and aluminum nitrate was evaluated using a peel test method. The plated copper technology is shown to surpass previous plated copper processes in performance and reliability
Keywords :
aluminium compounds; beryllium compounds; ceramics; circuit reliability; copper; printed circuit manufacture; Al2O3; AlN; BeO; Cu-Al2O3; Cu-AlN; Cu-BeO; PCB; adhesion; ceramic PC; copper-on-ceramic technology; peel test method; performance; reliability; Ceramics; Chemical technology; Circuits; Conductors; Copper; Gold; Manufacturing industries; Metallization; Metals industry; Thick films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
Type :
conf
DOI :
10.1109/ECTC.1990.122324
Filename :
122324
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1914593
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