Title :
Simulation based analysis of temperature effect on the faulty behavior of embedded DRAMs
Author :
Al-Ars, Zaid ; Van de Goor, Ad J. ; Braun, Jens ; Richter, Detlev
Author_Institution :
Fac. of Inf. Technol. & Syst., Delft Univ. of Technol., Netherlands
Abstract :
Temperature has proven to be an effective stress condition, commonly used to stress memory devices and to detect special types of failure mechanisms. In this paper a new approach is presented where temperature is used as a test parameter to increase the fault coverage of specific tests. This is done using defect injection and simulation of a memory model at different temperatures. The analysis presents new types of detection conditions for memories and evaluates the impact of temperature on these conditions
Keywords :
DRAM chips; SPICE; circuit simulation; embedded systems; failure analysis; fault location; integrated circuit testing; logic testing; thermal stresses; Spice; defect injection; defect simulation; embedded DRAM; failure mechanisms; fault coverage; fault primitives; functional fault models; memory model; memory testing; opens; stress condition; stress memory devices; temperature effect; test parameter; Analytical models; Circuit faults; Circuit simulation; Computational modeling; Failure analysis; Information technology; Random access memory; Stress; Temperature; Testing;
Conference_Titel :
Test Conference, 2001. Proceedings. International
Conference_Location :
Baltimore, MD
Print_ISBN :
0-7803-7169-0
DOI :
10.1109/TEST.2001.966700
