Post-process methodology on-a CMOS chip to release an extracellular microelectrode array

In the CMOS MEMS design the problems are centered on the sensor integration on-a-chip and its release post-process. The extracellular planar microelectrodes are straight form integrated due the layers CMOS possibilities, however the releasement of them must be done after the CMOS fabrication process. In this regard, the work presents the complete post-process methodology and the results of the technological post-process on 2.2mm×2.2mm square die. Preliminary results showed a) the viability of this post-process methodology and b) the on-chip functionality for extracellular in-vitro culture.