Title :
An Analytical Thermal Noise Model of deep submicron MOSFET´s for Circuit Simulation with Emphasis on the BSIM3v3 SPICE Model
Author_Institution :
Siemens AG, Munich, Germany
Conference_Titel :
Solid-State Device Research Conference, 1998. Proceeding of the 28th European
Conference_Location :
Bordeaux, France
Print_ISBN :
2-86332-234-6
