DocumentCode
1915694
Title
Advances in military hybrids
Author
Jones, Roydn D.
Author_Institution
Vitarel Mroelectronic., San Diego, CA, USA
fYear
1990
fDate
20-23 May 1990
Firstpage
1406
Abstract
The author discusses changes in the requirements and specifications of military hybrids, some of the changes occurring in their design, and some of the newer materials and techniques used in their manufacture. Particular attention is given to the computer-aided design of hybrids, substrate materials, thick-film materials and processes, thin-film materials and processes, the tape-transfer process, and assembly processes
Keywords
circuit CAD; hybrid integrated circuits; integrated circuit manufacture; military equipment; packaging; substrates; assembly processes; computer-aided design; dense packaging; military hybrids; substrate materials; tape-transfer process; thick-film materials; thin-film materials; CMOS technology; Certification; Hybrid integrated circuits; Integrated circuit technology; Manufacturing processes; Microelectronics; Military standards; Qualifications; Space technology; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/ECTC.1990.122329
Filename
122329
Link To Document