• DocumentCode
    1915819
  • Title

    A new test/diagnosis/rework model for use in technical cost modeling of electronic systems assembly

  • Author

    Trichy, Thiagarajan ; Sandborn, Peter ; Raghavan, Ravi ; Sahasrabudhe, Shubhada

  • Author_Institution
    CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    1108
  • Lastpage
    1117
  • Abstract
    This paper presents a test/diagnosis/rework analysis model for use in technical cost modeling of electronic assemblies. The approach includes a model of test operations characterized by fault coverage, false positives, and defects introduced in test, in addition to rework and diagnosis operations that have variable success rates and their own defect introduction mechanisms. The model can accommodate an arbitrary number of rework attempts on any given assembly and can be used to optimize the fault coverage and rework investment during system tradeoff analyses. The model´s implementation allows all inputs to the model to be represented as probability distributions thereby accommodating inevitable uncertainties in input data present during tradeoff activities and uses Monte Carlo methods to determine model outputs
  • Keywords
    Monte Carlo methods; assembling; costing; economics; electronic equipment manufacture; electronic equipment testing; fault diagnosis; modelling; probability; production testing; Monte Carlo methods; defect introduction mechanisms; defects; electronic assemblies; electronic systems assembly; false positives; fault coverage; probability distributions; rework investment; system tradeoff analyses; technical cost modeling; test operations; test/diagnosis/rework analysis model; Assembly systems; Cost function; Educational institutions; Electronic equipment testing; Fault diagnosis; Investments; Manufacturing; Probability distribution; System testing; Uncertainty;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2001. Proceedings. International
  • Conference_Location
    Baltimore, MD
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-7169-0
  • Type

    conf

  • DOI
    10.1109/TEST.2001.966737
  • Filename
    966737