DocumentCode :
1916003
Title :
Detailed Analysis of Buried Oxide Degradation Induced by Hot-Carrier Injection
Author :
Guichard, E. ; Cristoloveanu, S. ; Reimbold, G. ; Borel, G.
Author_Institution :
LETI, CEA-Technol. Av., Grenoble, France
fYear :
1993
fDate :
13-16 Sept. 1993
Firstpage :
825
Lastpage :
828
Abstract :
The degradations of the SIMOX buried oxide after either front channel stress in p-MOSFETs or back channel stress in n-MOSFETs are analyzed as a function of drain bias and correlated. It is found that this damage may be alleviated and the device lifetime extended over 10 years by scaling the drain bias below 3V.
Keywords :
MOSFET; SIMOX; hot carriers; SIMOX buried oxide; back channel stress; buried oxide degradation; drain bias; front channel stress; hot-carrier injection; n-MOSFET; p-MOSFET; Aging; Degradation; Electron traps; Hot carrier injection; Hot carriers; MOSFET circuits; Stress; Temperature; Testing; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1993. ESSDERC '93. 23rd European
Conference_Location :
Grenoble
Print_ISBN :
2863321358
Type :
conf
Filename :
5435616
Link To Document :
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