DocumentCode :
1916584
Title :
Study on the thermal stability of aluminum nanostructure
Author :
Chen, Xingjian ; Wang, Shulin ; Xu, Bo
Author_Institution :
Coll. of Energy & Power Eng., Univ. of Shanghai for Sci. & Technol., Shanghai, China
Volume :
2
fYear :
2011
fDate :
20-22 May 2011
Firstpage :
2027
Lastpage :
2031
Abstract :
Al nano-particles were prepared by a dry roller vibration milling at room temperature, and the particles size milled 4 hour was the range between 50 and 80nm. The products were annealed 2 hour in the extent of 100°C-330°C. By XRD and DSC testing, we study the effect heat treatment temperature on Al particles size and microstructure. The research indicated that Al nano-particles located in metastable high energy state, because the partial mechanical energy intake the material interior in the process of vibration milling with distortion and fault. Through some heat disorder, the surface energy, strain energy and fault energy of the material can mutually conversion. In the range from 240°C to 300°C, the deposited energy was given out resulting in the material interior energy reducing.
Keywords :
X-ray diffraction; aluminium; annealing; differential scanning calorimetry; heat treatment; milling; nanofabrication; nanoparticles; particle size; surface energy; thermal stability; Al; DSC testing; XRD; aluminum nanostructure; annealing; dry roller vibration milling; fault energy; heat disorder; heat treatment; mechanical energy; metastable high energy state; microstructure; nanoparticles; particle size; size 50 nm to 80 nm; strain energy; surface energy; temperature 100 degC to 330 degC; thermal stability; time 2 hour; Crystals; Heating; Microscopy; Synchrotrons; Temperature distribution; X-ray scattering; Al nanoparticles; dynamic recovery; fault energy; microstructure analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Renewable Energy & Environment (ICMREE), 2011 International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-61284-749-8
Type :
conf
DOI :
10.1109/ICMREE.2011.5930736
Filename :
5930736
Link To Document :
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