• DocumentCode
    1916719
  • Title

    Common voltage eliminating of SVM diode clamping three-level inverter connected to grid

  • Author

    Guo, Yougui ; Zeng, Ping ; Zhu, Jieqiong ; Li, Lijuan ; Deng, Wenlang ; Blaabjerg, Frede

  • Author_Institution
    Coll. of Inf. Eng., Xiangtan Univ., Xiangtan, China
  • Volume
    2
  • fYear
    2011
  • fDate
    20-22 May 2011
  • Firstpage
    2054
  • Lastpage
    2057
  • Abstract
    A novel method of common voltage eliminating is put forward for SVM diode clamping three-level inverter connected to grid by calculation of common voltage of its various switching states. PLECS is used to model this three-level inverter connected to grid and good results are obtained. First analysis of common mode voltage for switching states of diode clamping 3-level inverter is given in detail. Second the common mode voltage eliminating control strategy of SVM is described for diode clamping three-level inverter. Third, PLECS is briefly introduced. Fourth, the modeling of diode clamping three-level inverter is presented with PLECS. Finally, a series of simulations are carried out. The simulation results tell us PLECS is a very powerful tool to real power circuits modeling. They have also verified that proposed common mode voltage eliminating control strategy of SVM is feasible to control the diode clamping three-level inverter. But further research has to be done to get rid of the common mode voltage completely by controlling the voltages of two capacitors at the input terminal.
  • Keywords
    invertors; power grids; power semiconductor diodes; voltage control; PLECS; SVM diode clamping three-level inverter; common voltage eliminating; power circuits modeling; switching state; Equations; MATLAB; Passive optical networks; Switches; PLECS; Three-level inverter; common voltage eliminating; space vector modulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Materials for Renewable Energy & Environment (ICMREE), 2011 International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-61284-749-8
  • Type

    conf

  • DOI
    10.1109/ICMREE.2011.5930741
  • Filename
    5930741