Title :
Challenges and Recent Developments in Device Isolation Technology
Author_Institution :
Infineon Technologies AG, Munich, Germany
fDate :
11-13 September 2000
Keywords :
Application specific integrated circuits; Etching; Integrated circuit technology; Isolation technology; Lithography; Nonvolatile memory; Oxidation; Planarization; Silicon; System-on-a-chip;
Conference_Titel :
Solid-State Device Research Conference, 2000. Proceeding of the 30th European
Print_ISBN :
2-86332-248-6
DOI :
10.1109/ESSDERC.2000.194716
