Title :
Recent Progress on Advanced Interconnects
Author_Institution :
LETI-CEA, Grenoble, France
fDate :
11-13 September 2000
Keywords :
Capacitance; Cleaning; Conducting materials; Copper; Dielectric constant; Dielectric materials; Etching; Lithography; Space technology; Thermal conductivity;
Conference_Titel :
Solid-State Device Research Conference, 2000. Proceeding of the 30th European
Print_ISBN :
2-86332-248-6
DOI :
10.1109/ESSDERC.2000.194720
