Global Planarization of Ozone TEOS Oxide by Resist Etch Back for Sub-0.5μm Multilevel Metallization

Author

Neureither, B. ; Binder, F. ; Fischer, E. ; Gabric, Z. ; Koller, K. ; Röhl, S. ; Spindler, O.

Author_Institution

Siemens AG, Components Group, Otto-Hahn-Ring 6, 81730 Munich

fYear

1994

fDate

11-15 Sept. 1994

Firstpage

133

Lastpage

136

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Device Research Conference, 1994. ESSDERC '94. 24th European

Conference_Location

Edinburgh, Scotland

Print_ISBN

0863321579

Type

Filename

5435686

Link To Document