Title :
Tense-deformation condition in multi-layered structure
Author :
Zakalyk, Lyubiv ; Korzh, Roman ; Danchyshyn, Ihor ; Ivanyk, Rostyslav
Author_Institution :
Radio Eng. Fac., Lviv Polytech. Nat. Univ., Ukraine
Abstract :
Modelling of mechanical tensions in multi-layered structures taking into consideration the thickness of adhesive layers is carried out in this work. Modelling of tension-deformation conditions in multilayered structures makes it possible to forecast the reliability of multi-layered junctions in integrated circuits. Using the proposed model, it is possible to predict scaling of materials, appearance of cracks and increased structural defects.
Keywords :
adhesives; circuit reliability; deformation; integrated circuit packaging; interface structure; internal stresses; printed circuits; stress analysis; adhesive layer thickness; cracks; integrated circuits; materials scaling; mechanical tension modelling; multi-layered junction reliability; multi-layered structure; structural defects; tension-deformation condition; Assembly; Differential equations; Electronics packaging; Integrated circuit modeling; Integrated circuit packaging; Integrated circuit reliability; Integrated circuit technology; Mechanical factors; Predictive models; Stress;
Conference_Titel :
Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2002. Proceedings of the International Conference
Print_ISBN :
966-553-234-0
DOI :
10.1109/TCSET.2002.1015866
