DocumentCode
1918013
Title
Influence model of internal mechanical efforts on conducting contacts reliability
Author
Matviykiv, Mykhaylo ; Ivasyk, Yurij
Author_Institution
Dept. of Electron. Methods of Inf.-Comput. Technol., Nat. Univ. Lviv Polytech., Ukraine
fYear
2002
fDate
2002
Firstpage
93
Abstract
It was obtained a mathematical influence model of internal mechanical stresses for the refusal time of the conducting contacts inside integrated circuits in overload conditions of parameters electro diffusion degradation mechanism. It takes into account the deformation change of activation energy of electro migration process and is suitable for CAD/CAM use.
Keywords
electrical contacts; electromigration; internal stresses; reliability; CAD/CAM; activation energy; conducting contact; deformation coefficient; electrodiffusion; electromigration; integrated circuit; internal mechanical stress; mathematical model; overload condition; parameter degradation; refusal time; reliability; Computer aided manufacturing; Conductive films; Degradation; Grain boundaries; Integrated circuit modeling; Integrated circuit reliability; Mathematical model; Stress; Temperature; Turning;
fLanguage
English
Publisher
ieee
Conference_Titel
Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2002. Proceedings of the International Conference
Print_ISBN
966-553-234-0
Type
conf
DOI
10.1109/TCSET.2002.1015870
Filename
1015870
Link To Document