DocumentCode :
1918013
Title :
Influence model of internal mechanical efforts on conducting contacts reliability
Author :
Matviykiv, Mykhaylo ; Ivasyk, Yurij
Author_Institution :
Dept. of Electron. Methods of Inf.-Comput. Technol., Nat. Univ. Lviv Polytech., Ukraine
fYear :
2002
fDate :
2002
Firstpage :
93
Abstract :
It was obtained a mathematical influence model of internal mechanical stresses for the refusal time of the conducting contacts inside integrated circuits in overload conditions of parameters electro diffusion degradation mechanism. It takes into account the deformation change of activation energy of electro migration process and is suitable for CAD/CAM use.
Keywords :
electrical contacts; electromigration; internal stresses; reliability; CAD/CAM; activation energy; conducting contact; deformation coefficient; electrodiffusion; electromigration; integrated circuit; internal mechanical stress; mathematical model; overload condition; parameter degradation; refusal time; reliability; Computer aided manufacturing; Conductive films; Degradation; Grain boundaries; Integrated circuit modeling; Integrated circuit reliability; Mathematical model; Stress; Temperature; Turning;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2002. Proceedings of the International Conference
Print_ISBN :
966-553-234-0
Type :
conf
DOI :
10.1109/TCSET.2002.1015870
Filename :
1015870
Link To Document :
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