Abstract :
Summary form only given. Miniaturization, electric performance and cost have drove the package thinner and thinner. System-in-package (SIP) and system-on-chip (SOC) are two competitive solutions. SIP is becoming the mainstream in assembly, which is able to short the design cycle time and speed up the new product introduction, especially in the mobile phone, hand held product and memory products. Stack dice, PoP (package-on-package) is mature and has been widely and growing up the market share. Embedded dice/substrate, fan-out-WLCSP, and TSV (through silicon via) are coming soon. Many new technology, especially for memory has been developed, they will be discussed during the sections.
Keywords :
integrated circuit testing; system-in-package; system-on-chip; memory package testing; package-on-package; stack dice; system-in-package; system-on-chip; Assembly; Chemical engineering; Chemical technology; Costs; Mobile handsets; Packaging; Silicon; System testing; System-on-a-chip; Through-silicon vias;
