DocumentCode

1918619

Title

Current Capabilities/needs and future possibilities of multi-Chip-modules Summary

Author

Johnson, R.R.

Author_Institution

University of Utah

fYear

1991

fDate

17-19 June 1991

Keywords

Assembly; Costs; Dielectric substrates; Packaging; Production; Silicon; Testing; Thermal expansion; Thermal management; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Device Research Conference, 1991. 49th Annual

Conference_Location

Boulder, CO, USA

Print_ISBN

0-87942-647-0

Type

conf

DOI

10.1109/DRC.1991.664663

Filename

664663