• DocumentCode
    1919021
  • Title

    Electro-Thermo-Mechanical Field Analysis using SESES

  • Author

    Funk, J. ; Korvink, J.G. ; Wachutka, G. ; Baltes, H.

  • Author_Institution
    Physical Electronics Laboratory, ETH-Hönggerberg, CH-8093 Zurich
  • fYear
    1994
  • fDate
    11-15 Sept. 1994
  • Firstpage
    347
  • Lastpage
    350
  • Abstract
    We describe our simulation framework for coupled electro-thermo-mechanical (ETM) analysis of miniaturized transducers and electronic devices. The package is tailored to the specific requirements of micro-electro-mechanical structure design. It achieves high computational accuracy and performance on engineering workstations through the use of an automatic mesh adaptation algorithm [1]. A zone-coupling scheme allows for a considerable reduction of degrees of freedom (Dofs). A fast linear solver coupled with near-optimal finite element data structures enables the solution of complex devices with up to 100,000 finite elements on a workstation.
  • Keywords
    Analytical models; Computational modeling; Electrostatics; Equations; Finite element methods; Piezoelectric materials; Shape; Tensile stress; Thermal stresses; Workstations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1994. ESSDERC '94. 24th European
  • Conference_Location
    Edinburgh, Scotland
  • Print_ISBN
    0863321579
  • Type

    conf

  • Filename
    5435733