Full CMP Integration of TiN Damascene Metal Gate Devices

Author

Achard, H. ; Ducroquet, F. ; Coudert, F. ; Previtali, B. ; Lugand, J.F. ; Ulmer, L. ; Farjot, T. ; Gobil, Y. ; Heitzmann, M. ; Tedesco, S. ; Nier, M.E. ; Deleonibus, S.

Author_Institution

LETI-CEA, Grenoble, France

fYear

2000

fDate

11-13 September 2000

Firstpage

408

Lastpage

411

Keywords

Boron; Capacitors; Circuits; Degradation; Dielectrics; Fabrication; Implants; Inorganic materials; Tin; Ultra large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Device Research Conference, 2000. Proceeding of the 30th European

Print_ISBN

2-86332-248-6

Type

DOI

10.1109/ESSDERC.2000.194801

Filename

1503731

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