Application of thermoelectric cooling to electronic equipment: a review and analysis

Author

Simons, R.E. ; Chu, R.C.

Author_Institution

Int. Bus. Machines, Poughkeepsie, NY, USA

fYear

2000

fDate

2000

Firstpage

1

Lastpage

9

Abstract

This paper provides a review of thermoelectric cooling and its application to the cooling of electronic equipment. A background discussion of thermoelectric cooling is provided briefly citing early history, current developments, and the defining thermoelectric heat pumping equations. Several examples are provided of early IBM applications of thermoelectric cooling. An analysis to assess thermoelectric cooling enhancement in terms of increases in allowable power dissipation or chip temperature reduction is described along with results

Keywords

cooling; cryogenic electronics; digital computers; reviews; thermal management (packaging); thermoelectric devices; MCM application; allowable power dissipation; chip temperature reduction; computer cooling; cooling enhancement; cooling modules; cooling power density; electronic equipment; thermal resistance; thermoelectric cooling; thermoelectric heat pumping equations; Application software; Computer aided manufacturing; Coupling circuits; Electronic equipment; Electronics cooling; Electronics packaging; History; Refrigeration; Temperature distribution; Thermoelectricity;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE

Conference_Location

San Jose, CA

Print_ISBN

0-7803-5916-X

Type

conf

DOI

10.1109/STHERM.2000.837055

Filename

837055