Title :
Algorithmic extension of thermal field solvers: time constant analysis
Author :
Székely, V. ; Poppe, A. ; Rencz, M.
Author_Institution :
Dept. of Electron Devices, Tech. Univ. Budapest, Hungary
Abstract :
The time-constant spectrum representation is a useful description of the dynamic thermal behavior of packages, assemblies and microsystems. The paper presents the idea of the time constant spectrum representation of microelectronic structures, and provides an algorithm that can be used for time constant spectrum calculation in thermal simulator programs. Simulation examples demonstrate the applicability of the method
Keywords :
circuit simulation; convolution; function approximation; integrated circuit packaging; lumped parameter networks; micromechanical devices; step response; thermal management (packaging); thermal resistance; time-domain analysis; transient response; IC package; PCB; algorithmic extension; assemblies; complex thermal impedance; dynamic thermal behavior; integral function; lumped circuit; micro-membrane; microelectronic structures; microsystems; packages; thermal field solvers; thermal simulator programs; time constant analysis; time-constant spectrum representation; Algorithm design and analysis; Assembly; Capacitance; Circuits; Convolution; Electron devices; Impedance; Microelectronics; Packaging; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-5916-X
DOI :
10.1109/STHERM.2000.837068
