Title :
Low temperature CMOS experience at IBM
Author_Institution :
Server Product Power, Packaging & Cooling, IBM Corp., USA
Abstract :
Using as a basis experience gained at IBM, the author discusses how low temperature cooling will take on more focus in the future as the computer industry speeds toward increased chip power levels. The systems that have been designed with low temperature vapor compression cycles have shown that this technology provides a viable cooling technique for the future
Keywords :
CMOS digital integrated circuits; IBM computers; compressors; cooling; cryogenic electronics; microprocessor chips; refrigeration; workstations; CMOS processors; MCM; low temperature cooling; refrigeration system; server system; vapor compression cycles; workstation refrigeration; CMOS process; Control systems; Cooling; Manufacturing processes; Packaging; Refrigeration; System performance; Temperature; Valves; Workstations;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-5916-X
DOI :
10.1109/STHERM.2000.837072
