Thermal analysis and validation of MCMs

A thermal analysis methodology has been developed for modules with multiple heat sources to expedite the thermal design cycle, the majority of which takes place prior to the delivery of functional silicon. This methodology utilizes linear superposition to comprehend interactions between various heat sources within an MCM. Therefore, it is applicable to designs where material properties can be assumed constant with respect to the temperature range of interest. In design applications, this methodology can be used with good results for forced convection boundary conditions, as well as (within acceptable design limitations) natural convection boundary conditions. A case study is presented herein to demonstrate the analysis techniques and to validate the method using experimental data. Although design specific data has not been incorporated here, this methodology proved its usefulness in the next generation DRAM thermal design