Low cost, high thermal conductivity composite heat spreaders for power electronics

The increased power density of electronic devices requires new approaches to thermal management. Composite materials offer a unique way to tailor the thermomechanical properties. The use of high thermal conductivity fibers provides for the fabrication of high thermal conductivity composites. Carbon-Carbon (C-C) composites exhibiting up to 350 W/mK thermal conductivity were fabricated. This novel technology provides for a cost reduction down to $2/in². In addition a CTE match to Silicon was developed via Chemical Vapor Reaction (CVR) Silicon Carbide of the carbon matrix. Excellent thermal performance was achieved with this novel technology