Rapid design of heat sinks for electronic cooling using computational and experimental tools

Author

Subramanyam, Savithri ; Crowe, Keith E.

Author_Institution

Mater. & Controls Group, Texas Instrum. Inc., Attleboro, MA, USA

fYear

2000

fDate

2000

Firstpage

243

Lastpage

251

Abstract

Design of electronic cooling systems for high volume manufacturing within the time frame of months for increasingly aggressive performance and cost requirements is difficult without the use of sophisticated computational and experimental tools. Described here are the tools and methods for evaluating designs of electronic cooling heat sinks. Examples using thermal finite element analysis (FEA) and computational fluid dynamics (CFD) are presented. Quantitative data from wind tunnel testing compare well with model results. Qualitative data from infrared (IR) spectroscopy provides insight on the interfacial effect. Issues associated with the interface resistance are discussed

Keywords

computational fluid dynamics; cooling; finite element analysis; heat sinks; computational fluid dynamics; electronic cooling; heat sink design; infrared spectroscopy; interface resistance; thermal finite element analysis; wind tunnel testing; Computational fluid dynamics; Computer aided manufacturing; Costs; Design methodology; Electronics cooling; Finite element methods; Heat sinks; High performance computing; Infrared spectra; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE

Conference_Location

San Jose, CA

Print_ISBN

0-7803-5916-X

Type

conf

DOI

10.1109/STHERM.2000.837090

Filename

837090