DocumentCode
1920329
Title
MEMS high Q microwave inductors using solder surface tension self-assembly
Author
Dahlmann, G.W. ; Yeatman, E.M. ; Young, P.R. ; Robertson, I.D. ; Lucyszyn, S.
Author_Institution
Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK
Volume
1
fYear
2001
fDate
20-24 May 2001
Firstpage
329
Abstract
We present microwave inductors of 1.5 to 2.5 nH fabricated out-of-plane by a self-assembly process. The consequent de-coupling from the substrate allows improved Q (from 4 to 20) and frequency of maximum Q (from 0.5 GHz to 3 GHz) on low resistivity silicon substrates.
Keywords
Q-factor; inductors; micromechanical devices; microwave devices; self-assembly; soldering; surface tension; 0.5 to 3 GHz; MEMS microwave inductor; Q-factor; Si; de-coupling; out-of-plane fabrication; silicon substrate; solder surface tension self-assembly; Assembly; Coils; Dielectric substrates; Fabrication; Fasteners; Inductors; Micromechanical devices; Self-assembly; Spirals; Surface tension;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2001 IEEE MTT-S International
Conference_Location
Phoenix, AZ, USA
ISSN
0149-645X
Print_ISBN
0-7803-6538-0
Type
conf
DOI
10.1109/MWSYM.2001.966899
Filename
966899
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