A novel IGBT package to reduce current imbalance with pinfin baseplate

Conventional 2 in 1 IGBT package with 62mm×150 mm suffers from imbalance of current distribution and switching loss due to the different effect of internal electromagnetic field on multiple IGBT chips connected in parallel. A novel DBC (Direct Bonding Copper) layout was proposed in this paper to reduce the parasitics and the electromagnetic coupling between control loop and main current path. And a novel pinfin-baseplate was elaborated for this package to improve its thermal management performance. Both simulation and experiment shows that this package is superior to the conventional one in current sharing and thermal dissipation.