DocumentCode
1920890
Title
Full wave analysis of FET fingers using various semiconductor physical models
Author
Goasguen, S. ; Tomeh, M.M. ; El-Ghazaly, S.M.
Author_Institution
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
Volume
1
fYear
2001
fDate
20-24 May 2001
Firstpage
415
Abstract
We present a full wave simulation of FET fingers based on a global modeling approach. The electromagnetic fields inside the device are computed by a standard FDTD scheme and coupled to the semiconductor equations through the current density. Four different semiconductor models are used to characterize the active device. They are derived from the hydrodynamic model obtained by integration of Boltzmann´s equations. The I-V characteristics of the FET are obtained for the different models. The RF voltage gain and the S parameters can be compared. This is the first time that such an analysis is performed. The wave device interactions occurring in the FET can be modeled using various physical models. This allows us to determine which semiconductor model to use for a given gate length and a given frequency range when the electromagnetic interactions are simulated.
Keywords
Boltzmann equation; S-parameters; current density; finite difference time-domain analysis; microwave field effect transistors; semiconductor device models; Boltzmann´s equations; FET fingers; I-V characteristics; RF voltage gain; S parameters; current density; electromagnetic fields; electromagnetic interactions; frequency range; full wave analysis; gate length; global modeling approach; hydrodynamic model; microwave FETs; semiconductor equations; semiconductor physical models; standard FDTD scheme; wave device interactions; Computational modeling; Current density; Electromagnetic coupling; Electromagnetic fields; Equations; FETs; Fingers; Finite difference methods; Hydrodynamics; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2001 IEEE MTT-S International
Conference_Location
Phoenix, AZ, USA
ISSN
0149-645X
Print_ISBN
0-7803-6538-0
Type
conf
DOI
10.1109/MWSYM.2001.966919
Filename
966919
Link To Document