DocumentCode :
1920983
Title :
Electrical characteristics comparison between partially-depleted SOI and n-MOS devices investigation using Silvaco
Author :
Husaini, Yusnira ; Ismail, Mohd Hisyam ; Zoolfakar, Ahmad Sabirin ; Khairudin, Norhazlin
Author_Institution :
Fac. of Electr. Eng., Univ. Teknol. MARA, Shah Alam, Malaysia
fYear :
2010
fDate :
3-5 Oct. 2010
Firstpage :
532
Lastpage :
536
Abstract :
Investigation of electrical characteristics of partially-depleted SOI (silicon-on-insulator) and bulk-Si n-MOSFET devices in order to compare their electrical characteristics using Silvaco software was done and presented in this paper. Two specific channel lengths of the device that had been concentrated are 0.5 and 0.35 micron. The comparisons were focused on three main electrical characteristics that are leakage current, threshold voltage and subthreshold voltage. The device structures were constructed using Silvaco-Athena and the characteristics were examined and simulated using Silvaco-Atlas. Results were analyzed and presented to show that the electrical characteristics of fully-depleted SOI devices are better than that of bulk-Si devices. It has also shown that the partially-depleted SOI device is superior in the submicron region.
Keywords :
MOSFET; leakage currents; semiconductor device models; silicon-on-insulator; technology CAD (electronics); Si; Silvaco-Athena software; Silvaco-Atlas tool; TCAD; bulk Si n-MOSFET; channel length; electrical characteristics; leakage current; n-MOS device simulation; partially-depleted SOI device simulation; silicon-on-insulator n-MOSFET device; size 0.35 micron; size 0.5 micron; subthreshold voltage; threshold voltage; Doping; Leakage current; MOSFET circuits; Silicon; Silicon on insulator technology; Threshold voltage; ATLAS; NMOS; SILVACO-ATHENA; partially-depleted SOI; sub threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics & Applications (ISIEA), 2010 IEEE Symposium on
Conference_Location :
Penang
Print_ISBN :
978-1-4244-7645-9
Type :
conf
DOI :
10.1109/ISIEA.2010.5679408
Filename :
5679408
Link To Document :
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