DocumentCode :
1921736
Title :
Suppression of CoSix Induced Leakage Current Using Novel Capping Process for Sub-0.10um node SRAM Cell Technology
Author :
Kwon, H.S. ; Hwang, B.J. ; Cho, W.S. ; Chang, C.S. ; Kim, S.B. ; Park, Y. ; Ihm, H. ; Park, J.K. ; Kang, H.S. ; Jeong, J.H. ; Park, J.B. ; Jang, Y.C. ; Jung, S.M. ; Kim, Kinam
Author_Institution :
Semiconductor R&D Center, Samsung Electronics, Kyungki-Do, Korea (South)
fYear :
2002
fDate :
24-26 September 2002
Firstpage :
195
Lastpage :
198
Keywords :
Annealing; Diodes; Etching; Fabrication; Leakage current; Random access memory; Silicidation; Silicides; Space technology; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Device Research Conference, 2002. Proceeding of the 32nd European
Print_ISBN :
88-900847-8-2
Type :
conf
DOI :
10.1109/ESSDERC.2002.194903
Filename :
1503833
Link To Document :
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