DocumentCode
1921797
Title
Study of Self Heating Effects on Future SOI Devices Operation
Author
Yachou, Driss ; Gautier, Jacques
Author_Institution
LETI (CEA - Technologies Avancées) DMEL - CENG, BP85X, 38054 Grenoble Cedex 9, France. Fax: (33)76885183
fYear
1994
fDate
11-15 Sept. 1994
Firstpage
787
Lastpage
790
Abstract
In this work we give a thermal analytical model that is suitable for taking into account the lattice temperature in parameters extraction. This thermal model is used to estimate the self heating effects on future SOI devices operation.
Keywords
Analytical models; Heating; Lattices; Parameter extraction; Power transmission lines; Semiconductor films; Silicon; Temperature; Thermal conductivity; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1994. ESSDERC '94. 24th European
Conference_Location
Edinburgh, Scotland
Print_ISBN
0863321579
Type
conf
Filename
5435838
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