Title :
Using RSM Techniques to Contour Plot Response Distributions of Semiconductor Processes
Author :
Walton, A.J. ; Fallon, M. ; Newsam, M.I. ; Ferguson, R.S. ; Sprevak, D.
Author_Institution :
Dept Elect Eng, Kings Buildings, University of Edinburgh, Edinburgh,EH9 3JL, UK
Abstract :
This paper presents a method that can be used as part of a Design For Manufacturability (DFM) procedure. The equations that form the response surfaces are used to obtain distribution parameters and this data is used to create response surfaces of the distributions. This then enables the process designer to choose the optimum processing conditions and set realistic specifications on the process parameters.
Keywords :
Buildings; Design for manufacture; Equations; Manufacturing processes; Optimization methods; Process design; Response surface methodology; Robustness; Semiconductor device manufacture; US Department of Energy;
Conference_Titel :
Solid State Device Research Conference, 1994. ESSDERC '94. 24th European
Conference_Location :
Edinburgh, Scotland
