DocumentCode :
1922837
Title :
Study of LDD Implantation Influence on ESD Failure Threshold using Electrothermal Simulation
Author :
Leroux, C. ; Buj, C. ; Chante, J-P.
Author_Institution :
LETI (CEA - Technologies Avancées), DMEL, CENG, 17, rue des Martyrs, 38054 Grenoble Cedex 9 FRANCE
fYear :
1995
fDate :
25-27 Sept. 1995
Firstpage :
321
Lastpage :
324
Abstract :
In CMOS technologies, hardness to ESD events is becoming a major reliability issue. In this context, NMOS transistors are particularly sensible. This study focus on the influence of LDD implantation on ESD failure threshold. ESD tests performed on elementary devices demonstrate the lower performance of LDD transistors. For NMOS transistors with and without LDD, electrothermal simulation have been performed, they lead to results similar to experimental ones, and give an explanation for greater heating in gradual junction.
Keywords :
Breakdown voltage; CMOS technology; Electrostatic discharge; Electrothermal effects; Heating; MOS devices; MOSFETs; Performance evaluation; Temperature; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1995. ESSDERC '95. Proceedings of the 25th European
Conference_Location :
The Hague, The Netherlands
Print_ISBN :
286332182X
Type :
conf
Filename :
5435888
Link To Document :
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