• DocumentCode
    1923438
  • Title

    Redundancy versus lifetime tradeoff analysis for environment monitoring using wireless sensor networks

  • Author

    Guo, Yuan ; McNair, Janise

  • Author_Institution
    Electr. & Comput. Eng., Florida Univ., Gainesville, FL
  • fYear
    2006
  • fDate
    24-28 April 2006
  • Lastpage
    77
  • Abstract
    Recent advancements of microelectronics and network protocol research enable the vast applications of wireless sensor network in industry and home environments. For example, the research in this paper is part of a NASA hydrogen detection to provide early detection of hydrogen leaks in storage facilities and transportation processes. Reliability issues play a vital role to ensure the quality of service of these applications, as well as to maintain the detection and response capabilities. In this paper, we provide a reliability analysis of a wireless sensor network based on the MIL-HDBK-217 reliability prediction model, and we examine the tradeoffs of enhancing the reliability of the network through redundancy of sensor network sleep sets, versus maximizing the energy-based lifetime of the network. An optimal number of sleep sets can be found, based on the given functional failure and the battery power expense models
  • Keywords
    environmental management; gas sensors; reliability; wireless sensor networks; MIL-HDBK-217; NASA hydrogen detection; battery power expense models; environment monitoring; functional failure; hydrogen leaks; microelectronics; network protocol; network reliability; quality of service; reliability prediction model; sensor network sleep sets; storage facilities; transportation processes; wireless sensor networks; Hydrogen storage; Leak detection; Microelectronics; Monitoring; NASA; Quality of service; Redundancy; Transportation; Wireless application protocol; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Dependability and Security in Sensor Networks and Systems, 2006. DSSNS 2006. Second IEEE Workshop on
  • Conference_Location
    Columbia, MD
  • Print_ISBN
    0-7695-2529-6
  • Type

    conf

  • DOI
    10.1109/DSSNS.2006.9
  • Filename
    1630364