Title :
Multi-mode interleaved boost converter for photovoltaic power systems with low-voltage ride-through capability
Author :
Cheng-Yu Tang ; Yao-Ting Chen ; Yen-Fu Chen ; Yaow-Ming Chen ; Yung-Ruei Chang
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
The objective of this paper is to propose a multi-mode interleaved boost converter for three-phase photovoltaic (PV) power systems with low-voltage ride-through (LVRT) capability. The proposed interleaved boost converter is able to continuously extract active power from the PV arrays during the grid voltage sag. After the grid voltage returns to its normal condition, the PV inverter can quickly achieve its maximum power point tracking (MPPT) operation. Also, the boost converter with multi-channel interleaved structure can increase power conversion efficiency but decrease input current ripple. Furthermore, the three-phase inverter with the maximum current limitation control can provide maximum reactive power under the allowable current amplitude during the voltage sag as well as output the demanded reactive/rated current ratio to meet different LVRT codes. Experimental results obtained from a 3 kVA prototype circuit demonstrate the performance of the proposed circuit topology.
Keywords :
maximum power point trackers; photovoltaic power systems; power convertors; power supply quality; LVRT capability; MPPT operation; PV arrays; PV inverter; PV power systems; active power; apparent power 3 kVA; grid voltage sag; input current ripple; low-voltage ride-through capability; maximum current limitation control; maximum power point tracking operation; maximum reactive power; multichannel interleaved structure; multimode interleaved boost converter; photovoltaic power systems; power conversion efficiency; reactive-rated current ratio; three-phase inverter; Circuit faults; Inverters; Maximum power point trackers; Reactive power; Voltage fluctuations; Interleaved Converter; LVRT; MPPT; PV power system;
Conference_Titel :
Energy Conversion Congress and Exposition (ECCE), 2013 IEEE
Conference_Location :
Denver, CO
DOI :
10.1109/ECCE.2013.6646827