Title :
Wafer and/or chip bonding adhesives for 3D package
Author :
Nonaka, Toshihisa ; Fujimaru, Koichi ; Shimada, Akira ; Asahi, Noboru ; Tatsuta, Yoshiko ; Niwa, Hiroyuki ; Tachibana, Yasuko
Author_Institution :
Toray Ind., Inc., Otsu, Japan
Abstract :
For 3D package application the demanded feature of chip bonding adhesive was discussed and the material was developed, which was wafer level process compatible NCF (Non conductive sheet). It should be high flowability for lamination on a bumped wafer surface without void, diced with wafer without deformation or sticking dust, transparent for alignment mark detection and low coefficient of thermal expansion (CTE) for the package thermal cycle durability. The nano particle dispersed and highly loaded NCF has been developed to satisfy the demanded characteristics. The CTE was 37°C/ppm and 1% weight loss temperature is higher than 350°C. The photosensitive NCF has been also developed. Bump top adhesive can be removed completely by photolithography before bonding process. It can wipe off the anxiety of adhesive residue between bump and pad. This material is also good for lamination and has high heat resistance of 1% weight loss temperature higher than 300°C.
Keywords :
adhesive bonding; adhesives; chip scale packaging; crack detection; durability; nanoparticles; photolithography; thermal expansion; wafer bonding; wafer level packaging; 3D package application; CTE; alignment mark detection; bump top adhesive; bumped wafer surface; chip bonding adhesive; coefficient of thermal expansion; nanoparticle; nonconductive sheet; photolithography; photosensitive NCF; thermal cycle durability; wafer bonding adhesive; wafer level process compatible NCF; Bonding; Lamination; Temperature measurement; Three dimensional displays; Viscosity;
Conference_Titel :
CPMT Symposium Japan, 2010 IEEE
Conference_Location :
Tokyo
Print_ISBN :
978-1-4244-7593-3
DOI :
10.1109/CPMTSYMPJ.2010.5679534