Title :
[Copyright notice]
Abstract :
The following topics are dealt with: advanced packaging; board level reliability; electrical design; interconnect; optical transmission; electrical transmission; 3D integration; mechanical design; thermal design; and optoelectronics.
Keywords :
integrated circuit design; integrated circuit interconnections; optoelectronic devices; packaging; 3D integration; advanced packaging; board level reliability; electrical design; electrical transmission; interconnect; mechanical design; optical transmission; optoelectronics; thermal design;
Conference_Titel :
CPMT Symposium Japan, 2010 IEEE
Conference_Location :
Tokyo
Print_ISBN :
978-1-4244-7593-3
DOI :
10.1109/CPMTSYMPJ.2010.5679541
